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Taiwan Semiconductor Manufacturing Co. (TSMC) is expected to provide updates on its capital expenditure plans and the progress of its advanced chipmaking technologies at its investor conference scheduled for Thursday, Focus Taiwan reported.
Liu Pei-chen, a researcher at the Taiwan Institute of Economic Research, told CNA on Friday that TSMC's capital expenditure could reach a record high over the next three years as the company continues to prioritise investments in advanced semiconductor manufacturing technologies. "TSMC's accumulated capex could top US$150 billion during the three-year period," Liu said, according to the report. At its investor conference in April, TSMC said it expects its 2026 capital expenditure to be at the higher end of its previously guided range of USD 52 billion to USD 56 billion. Liu further stated that the company has also expanded production of its advanced 3-nanometre and 2-nanometre chips to overseas facilities in Arizona, US, and Kumamoto, Japan. TSMC began mass production of its latest 2-nanometre process technology in Taiwan last year, it said. The economist said TSMC has maintained stable yields for its advanced manufacturing processes, built a strong customer trust ecosystem, and preserved its technological lead over rivals such as Intel and Samsung Electronics. To strengthen its leadership in the global semiconductor market, Liu said TSMC is expected to continue allocating the bulk of its capital expenditure towards its 2-nanometre process and next-generation technologies, while accelerating the expansion of its overseas manufacturing footprint. He also expects the company to increase investments in its advanced Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, highlighting TSMC's chips are also used in high-end smartphones and high-performance computing devices, and for high-bandwidth memory chips. (ANI)
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