Monday, July 15, 2024
News
NEWS HOME
»
PRN INDIA
Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027
  SocialTwist Tell-a-Friend  
   

SEMI, TECHCET and TechSearch International Highlight Diverse Growth Drivers in New Report  

MILPITAS, Calif., May 23, 2023 /PRNewswire/ -- Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report.

 

High-performance applications, 5G, artificial intelligence (AI) and the adoption of heterogeneous integration and system-in-package (SiP) technologies are increasing demand for advanced packaging solutions. The development of new materials and processes to enable chips with higher transistor density and greater reliability are also contributing to market growth.

"The semiconductor packaging materials industry is undergoing significant changes as new technologies and applications are driving demand for more advanced and diverse materials," said Jan Vardaman, President and founder of TechSearch International. "Advances in dielectric materials and underfill are driving strong demand for fan-in and fan-out wafer level packaging (FOWLP), flip chip, and 2.5D/3D packaging. New substrate technologies such as silicon interposers and organic interposers using RDL (Re-Distribution Layer) are also key growth drivers of packaging solutions. At the same time, research on laminate substrates with finer features continues with the development of glass cores for build-up substrates."

The Global Semiconductor Packaging Materials Outlook report provides a comprehensive analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer level package dielectrics, and wafer-level plating chemicals.

Features of the report include:

  • Technology trends
  • Regional market size
  • Five-year market forecast to 2027
  • Market size in revenue and units
  • Excel workbook file summarizing market information
  • Supplier market share
  • Capacity and utilization trends

The report  is available for purchase from  SEMI.  

About SEMI
SEMI ® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on  LinkedIn  and  Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email:  mhall@semi.org

 

 

SEMI ® connects 2,000+ member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. SEMI builds connections that help its members prosper, create new markets, and address common industry challenges together. Visit http://www.semi.org

Logo - https://mma.prnewswire.com/media/469944/Semi_Logo.jpg

Cision View original content:https://www.prnewswire.co.uk/news-releases/global-semiconductor-packaging-materials-market-to-near-30-billion-by-2027-301830302.html

More News by PR Newswire India

/DISREGARD RELEASE: Bybit/

Kushal's Fashion Jewellery Festive Collection, adorned by Tara Sutaria, beautifully combines glamour and elegance

Unilumin Group Signed an Agreement with Saudi Arabia in the Third Belt and Road Forum for International Cooperation

Transport Corporation of India Ltd. (TCI Group) has been recognized as a Maritime Excellence Achiever at GMIS 2023 by The Ministry of Ports, Shipping & Waterways on 19th October 2023

Bitget Introduces 'Futures Quant' With AI Features

Bitget's Q3 Growth: Second-Highest Market Share Surge and Record High for BGB Holders

HarperCollins Publishers India is proud to announce the publication of SPREADING JOY: How Joyalukkas Became the World's Favourite Jeweller by Joy Alukkas with Thomas Scaria and Nidhi Jain

Go Global or Go Home: New Report Reveals Companies Lacking Global Presence Will Lose Growth Opportunities

MOVIN rolls out the second phase of Electric Vehicles in Bengaluru paving the way for greener deliveries in logistics

Motilal Oswal Financial Services Ltd. (MOFSL) launches #CorporateMushaira, an audio-first campaign for the World Investor Week

UBBF 2023 Intelligent IP Network Summit in Dubai an Impressive Success

Placing Them Right: IBS Path to MBA Career Success

HDFC ERGO reiterates its commitment on making health insurance Accessible, Affordable and Convenient with launch of 6 new products and 2 service upgrades

capSpire expands its global footprint with entry into the Singapore market

GTPL Hathway records its highest quarterly revenues from operation

CCTV+: International reporters experience the romance and vitality of Hangzhou, China

STL expands its Enterprise Networking solution portfolio with Estelan

Mantittude: Skincare for Men encourages men to unleash their inner 'Pataka' this Diwali

The 134th Canton Fair Opened with Optimized Structure and Upgraded Scale

MADAME TUSSAUDS SINGAPORE UNVEILS LIFELIKE FIGURE OF CRICKET ICON VIRAT KOHLI AMIDST ICC MEN'S CRICKET WORLD CUP!

Ugreen unveils power solutions and personal data storage at the Gitex Trade Show in United Arab Emirates.

Meridean Overseas Education Consultants Announces Half-Day Leave to Celebrate India vs. Pakistan Cricket Match

Xinhua Silk Road: Huai'an, UNESCO creative city of gastronomy, explores innovative dev. of food industry via premier regional food expo

Xinhua Silk Road: Fengxin County in E. China's Jiangxi celebrates bountiful harvest of kiwifruit

Casio to Release G-SHOCK Watches with Shining Metallic-Colored Dials

UEG Week 2023 : Babies with a low birthweight four times more likely to develop fatty liver disease in later life

CGTN: Diffusion of tea and its culture along the Silk Road

NEOM announces Leyja, its latest sustainable tourism destination

Expand North Star 2023 kicks off in Dubai gathering game-changing start-ups to accelerate on global stage

World Health Summit kicks off in Berlin

Hexaware Technologies announces new office in Dehradun to bolster its global delivery network

Chinese automotive industry has overtaken to supercars

Participants of the Made in Russia business mission to India held more than 150 negotiations with local importers and distributors

Rummy Passion Raises the Bar: Instant Withdrawals Now Available for All Tiers

 
 
TRENDING TOPICS
 
 
CITY NEWS
MORE CITIES
 
 
INDIA WORLD ASIA
Odisha: Lord Jagannath, siblings placed ...
Heavy rain lashes parts of Delhi; many a...
Home Minister speaks to CMs of Assam, UP...
BJP workers stage protests against Delhi...
After this government came into power, d...
Jharkhand Chief Minister Soren meets Pri...
More...    
 
 Top Stories
Sopra Steria launches an internatio... 
Rustomjee Group Unveils 'Ocean Vist... 
Lanka Premier League 2024: Gurbaz-S... 
Bulkcorp International receives in-... 
Union Sports Minister inaugurates B... 
Mari State University Celebrates MB... 
Pakistan: 3 die as car plunges into... 
Russian Army marches on 'Made in Bi...